SIMULATION OF BONDED/BREAKABLE CONTACTS IN PCB DROP TEST USING EXPLICIT DYNAMICS
Keywords:
PCB, Drop Test,, Explicit Dynamics,, FEA, Heat Sink,, Contact ModelingAbstract
Modeling and simulation of board-level drop tests were conducted for a Flip Chip on Board (FCOB) assembly. The
printed circuit board (PCB) specimen measured 185 mm × 150 mm and included large (8 mm × 8 mm) and small (3
mm × 3 mm) flip chips mounted with underfill encapsulation.
The PCB was clamped at two edges and subjected to a free-fall drop of 1 meter using a shock test machine.
Experimental measurements were obtained using a high-speed camera, accelerometer, and strain gauges.
Finite Element Analysis (FEA) was performed using explicit dynamics in ANSYS 2025 R2. Two simulation
approaches were implemented: a stress-based breakable model and a non-breakable bonded model. The numerical
results were compared with experimental data in terms of displacement, strain, acceleration, and equivalent stress.
The study demonstrates that explicit dynamic simulation provides accurate prediction of PCB response during drop
impact and allows modeling of bonded and breakable contacts effectively.
